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Chinese chipmakers are attempting to fortune in production on FD-SOI wafers


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 Chinese chipmakers are attempting to fortune in production on FD-SOI wafers


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POSTER: computer news   ||    CHINESE CHIPMAKERS ARE ATTEMPTING TO FORTUNE IN PRODUCTION ON FD-SOI WAFERS

DATE:2017-02-19

Chinese semiconductor manufacturers for a quite a long time can not master the production of chips with the norms of 14 nm and FinFET transistors.  This prevent outright ban on the import of advanced production technology and yet insufficient scientific potential in China (or rather - lack of developments). Also, the Chinese producers will be clearly  difficult to compete with the industry leaders, have already mastered the 14-nm process technology, including Intel, Samsung, GlobalFoundries and TSMC.  The output can be found in the development of production in the FD-SOI wafers with 28 nm standards.    But this idea, according to the latest publications on the site to DigiTimes, gets more and more supporters among Chinese chip manufacturers.

FD-SOI plates - a plate with a thin layer of fully depleted insulator.  Due to this layer eliminates the effect of random appearance of floating parasitic charge in the neutral layer under the transistor.  Thus, if the thickness of the insulator in the conventional SOI wafer ranges from 50-90 nm, the thickness of the insulator in the FD-SOI wafer is reduced to 5-20 nm.  For the FD-SOI is sometimes referred to as ultra-thin SOI.

Thanks to FD-SOI chips with the norms of 28 nm have better performance than 28-nm solutions in conventional monolithic plates.  In a rough approximation, we can say that the 28-nm process technology on FD-SOI wafers in some cases, can be considered as an analogue of 14-nm FinFET process technology.  This is true for the simple production of electronic components in the form of chips for things with an Internet connection and for other applications where cost savings can be combined with high energy efficiency and, to a lesser extent, with the growth of productivity.

According to DigiTimes, the production on FD-SOI wafers interested   Chinese chip maker, the company Shanghai Huali Microelectronics (HLMC).  The manufacturer has a 300-mm production and feel the demand for solutions with advanced features at a reasonable price that can meet the production on FD-SOI substrates.  It should be noted that the company GlobalFoundries recently announced plans to build China's advanced manufacturing with the intention to introduce it to issue decisions on FD-SOI substrates.  Mass production at the plant (Chengdu) is scheduled for 2019.  


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 Chinese chipmakers are attempting to fortune in production on FD-SOI wafers


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